Huawei is working together with Semiconductor Manufacturing International Corp (SMIC) on the development of an advanced 3 nm chip that will be available in 2026, according to MSN, based on an article from the Taiwan Economic Daily.
According to the article, Huawei is adopting a gate-all-around (GAA) architecture, used by Samsung Foundry, and is moving away from traditional silicon designs. Huawei's current line of Kirin processors and Ascend AI chips is manufactured using 7 nm node technology.