The board of directors of Telefónica del Perú approved a series of financial measures during its session on May 16, 2025, according to the company’s report to the Superintendency of the Securities Market. Among these measures is the capitalization of US$ 65.4 million corresponding to a loan granted by Integra Tec International on April 16, as well as other amounts related to a commercial credit agreement acquired on April 14, 2025.